High-Frequency RT/duroid 5880 4-Layer PCB with 3.0mm Thickness for RF Applications
1.Introduction
Rogers RT/duroid 5880 high-frequency laminates are PTFE composites reinforced with glass microfibers, designed for precision stripline and microstrip circuits. The randomly oriented microfibers ensure exceptional dielectric constant uniformity, making them ideal for applications requiring consistent electrical performance across wide frequency ranges, including Ku-band and beyond.
These laminates offer low dissipation factor (0.0009 at 10GHz) and stable dielectric properties, critical for millimeter-wave, radar, and airline broadband antennas. RT/duroid 5880 is easily machined, cut, and resistant to solvents used in PCB etching and plating, ensuring durability in harsh environments.
With low moisture absorption (0.02%) and isotropic properties, this material is well-suited for high-moisture and high-reliability applications. Its compatibility with standard PCB fabrication processes makes it a preferred choice for aerospace, defense, and telecom systems.
2.Features
Dielectric Constant (Dk): 2.2 ±0.02 at 10GHz/23°C
Dissipation Factor (Df): 0.0009 at 10GHz
Temperature Coefficient (TCDk): -125 ppm/°C
Moisture Absorption: 0.02%
CTE: X-axis 31 ppm/°C, Y-axis 48 ppm/°C, Z-axis 237 ppm/°C
Isotropic Properties
Benefits
Uniform electrical properties over a wide frequency range.
Easy to machine and cut, compatible with standard PCB processes.
Resistant to solvents and reagents, ensuring durability.
Lowest electrical loss among reinforced PTFE materials.
Ideal for high-moisture environments.
3.PCB Specifications at a Glance
| Parameter | Specification |
|---|---|
| Base Material | RT/duroid 5880 / RO4450F |
| Layer Count | 4 layers |
| Board Dimensions | 50mm x 60mm (±0.15mm) |
| Minimum Trace/Space | 5/7 mils |
| Minimum Hole Size | 0.45mm |
| Blind Vias | Top to Inner Layer 3 |
| Finished Thickness | 3.0mm |
| Copper Weight (All) | 1oz (35µm) |
| Via Plating Thickness | 20µm |
| Surface Finish | OSP (Organic Solderability Preservative) |
| Solder Mask (Top/Bottom) | None / None |
| Silkscreen (Top/Bottom) | None / None |
| Electrical Test | 100% tested prior to shipment |
4.PCB Stackup: 4-layer rigid PCB
| Layer | Material Type | Thickness |
|---|---|---|
| Top Copper (L1) | Copper | 35 μm |
| Core | RT/duroid 5880 | 1.575 mm |
| Inner Copper (L2) | Copper | 35 μm |
| Prepreg | RO4450F | 0.102 mm |
| Core | RT/duroid 5880 | 0.787 mm |
| Prepreg | RO4450F | 0.102 mm |
| Inner Copper (L3) | Copper | 35 μm |
| Core | RT/duroid 5880 | 0.254 mm |
| Bottom Copper (L4) | Copper | 35 μm |
5.PCB Statistics:
Components: 10
Total Pads: 35
Thru Hole Pads: 21
Top SMT Pads: 14
Bottom SMT Pads: 0
Vias: 22
Nets: 6
6.Typical Applications
Commercial airline broadband antennas
Microstrip and stripline circuits
Millimeter-wave applications
Radar and guidance systems
Point-to-point digital radio antennas
7.Quality Assurance
IPC-Class 2 compliant
100% electrical tested
Global availability
Gerber RS-274X support
This RT/duroid 5880 PCB combines ultra-low loss, stable RF performance, and rugged reliability, making it ideal for high-frequency and mission-critical applications.